| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| LD1086DT33TR | 其他被动元件 |
ST/意法 |
TO-252 |
18+ |
2500 |
|||
| SR100TUK/B22BA | 其他IC |
NXP/恩智浦 |
BGA |
21+ |
6000 |
|||
| 88F8215-A0-BWO4C000 | 接口IC |
MARVELL |
BGA |
2020 |
165 |
|||
| LFE3-70EA-8FN672I | 视觉、图像传感器 |
LATTICE/莱迪斯 |
BGA |
20+ |
109 |
|||
| LTC4234HWHH#PBF | 存储IC |
ADI/亚德诺 |
QFN-38 |
2020 |
680 |
|||
| INDM200C-S01-19-L | 存储IC |
INPHI CORPORATION |
BGA |
2018 |
3 |
|||
| LTM4691IV#PBF | 存储IC |
ADI/亚德诺 |
LGA24 |
2019 |
960 |
|||
| B1205LM-1W | 电源模块 |
MORNSUN/金升阳 |
DIP |
2019 |
6050 |
|||
| CA009-S101-001 | 端子、接插件 |
Yamachi |
DIP |
2019 |
500 |
|||
| V54C3256164VHI7I | 存储IC |
PROMOS TECHNOLOGIES |
TSOP54 |
2011 |
501 |
|||
| X1E000401000400 | IC |
EPSON/爱普生 |
SMD |
19+ |
3800 |
|||
| BCM7360APKFEBA3G P10 | 存储IC |
BROADCOM/博通 |
BGA |
2013 |
618 |
|||
| TMS320DM8167SCYG2 | IC |
TI/德州仪器 |
BGA |
16+ |
5 |
|||
| PI7C9X440SLBFDE | IC |
PERICOM/百利通 |
QFP |
2015 |
120 |
|||
| UPD178046GK-517-9EU | IC |
RENESAS/瑞萨 |
QFP |
2014 |
595 |
|||
| ESD56171D04-3/TR | IC |
WILLSEMI/韦尔 |
DFN |
21+ |
21000 |
|||
| LM75BDP/DG118 | 湿敏传感器 |
NXP/恩智浦 |
MSOP-8 |
2020 |
2500 |
|||
| SZMMBZ39VCLT1G |
|
贴片三极管 |
ONSEMI/安森美 |
SOT23-3 |
3609 |
|||
| TMS320C6424ZDUQ6 | IC |
TI/德州仪器 |
BGA |
2014 |
70 |
|||
| PF240D25R-7760 | 通信继电器 |
CRYDOM |
SIP-4 |
20+ |
60 |
商家默认展示20条库存